{"product_id":"9783031005756","title":"Three-Dimensional Integration and Modeling : A Revolution in RF and Wireless Packaging by Jong-Hoon Lee","description":"This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity\/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF\/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction \/ Background on Technologies for Millimeter-Wave Passive Front-Ends \/ Three-Dimensional Packaging in Multilayer Organic Substrates \/ Microstrip-Type Integrated Passives \/ Cavity-Type Integrated Passives \/ Three-Dimensional Antenna Architectures \/ Fully Integrated Three-Dimensional Passive Front-Ends \/ References\u003cbr\u003eBinding: Paperback \/ softback","brand":"Gardners","offers":[{"title":"Default Title","offer_id":56309615198581,"sku":"9783031005756","price":27.99,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0612\/7193\/3106\/files\/9783031005756.jpg?v=1762812570","url":"https:\/\/backstory.london\/products\/9783031005756","provider":"Backstory","version":"1.0","type":"link"}