{"title":"A S M International","description":null,"products":[{"product_id":"9781627084192","title":"ISTFA 2021","description":"The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; scanning probe analysis; hardware attacks, security, and reverse engineering; microscopy and material characterization; nanoprobing and electrical characterization; and more.\u003cbr\u003e\u003cbr\u003eIn the 21st century, the electronic market will be driven by consumers with demands of immediate entertainment, fast access to information, and communications anywhere in a personalized fashion and at affordable prices. 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This potential of dual positive or negative impact on engineered components and products is a major factor why understanding and deploying residual stresses in engineering design is so critical. 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The new volume expands on the fundamental principles of welding, including heat transfer, solidification, residual stress and distortion, and has an all-new section on modeling and simulation of welding processes. Articles cover all welding processes, from the workhorse methods of arc and resistance welding, to newer methods like friction stir welding and laser beam welding, to specialty methods like explosive welding and ultrasonic welding. One-third of the articles are all-new, and welding articles from the 1993 edition have been updated and expanded, making this volume the most complete reference source anywhere on welding fundamentals and processes. 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